Our client is a sizable firm that focuses in innovation and technology.

Senior Engineer (HI LAB)
 
Responsibilities:

• Provide support the procurement of 3D System in Package (3D SIP) common equipment.
• Work on 3D SIP common Equipment Installation and Operation.
• Work on HI Lab users equipment set-up and application
• Operate 3D SIP common equipment for HI Lab users based on HI Lab users’ requirements.
• Perform any other ad hoc duties as assigned by HKSTP’s representatives.

Requirements:

• University degree preferably in Science, Engineering or related disciplines.
• At least 6 years’ experience in microelectronics especially in advanced packaging and 3D System in Package and equipment operation.
• Proper training in testing, commissioning, and operation of 3D System in Package equipment.
• Excellent communication and interpersonal skills, have the flair to articulate clearly to all levels of people
• Experience in cleanroom laboratory works
• Proficiency in both spoken and written English and Chinese (including Putonghua)

Interested candidates, please send your resume (MS Word document) including employment history, present and expected salary to cv@delken.com.hk.

For more jobs, please visit our website: www.delken.com.hk. 

(All personal data submitted will be treated in strict confidential and used for recruitment purposes only.)